エポキシ樹脂と金属基板接合界面の高温劣化メカニズム (Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature)
特任准教授(常勤) 陳 伝彤、特任教授 菅沼 克昭(産業科学研究所)
CHEN Chuantong , SUGANUMA Katsuaki (SANKEN (The Institute of Scientific and Industrial Research))
